共找到 150 條與 電子膠粘帶 相關的標準，共 10 頁
Adhesive bondings in electronic applications - Determination of thermal conductivity of materials for heat dissipation
Polymers. Method for determination of viscosity by rotary viscosimeter at a given shear rate
MJLA-87135. dated 20 Jan 89, is inactive for new design and is no longer used, except for replacement purposes
ADHESIVES, NON-CONDUCTIVE, FOR ELECTRONICS APPLICATION
Determination method of viscosity of molecular sieve activated powder
Test method for viscosity of electronic glass at high temperature
This specification i s approved f o r use by The A i r Force Materials Laboratory, Department of the A I r Force, and I s available f o r use by a l l
ADHESIVES, NON-CONDUCTIVE, FOR ELECTRONICS APPLICATION
For the purpose of the initial version of this document@ the discussion of adhesives will be limited to liquid@ paste and gel materials and closely
Handbook on Adhesive Bonding in Electronic Assembly Operations
MIL-A-87135(USAF) dated 16 February 1979 has been reviewed and determined to be valid for use in acquisition
ADHESIVES, NON-CONDUCTIVE, FOR ELECTRONICS APPLICATION
本文件規定了粘貼式直流變頻轉子生產線的結構和基本參數、技術要求、試驗方法、檢驗規則、標志、包裝、運輸和貯存
Sticky-type Direct Current Inverter Rotor Production Line
The document specifies a method to give an indication of the ability of an adhesive tape to cause corrosion. If amounts of water-soluble ions
Self adhesive tapes - Determination of the water-soluble corrosive ions; German version EN 12029:1996
Adhesive bondings in electronic applications - Bonding strength on surfaces - Part 1: Tensile test
Adhesive bondings in electronic applications - Bonding strength at surfaces - Part 2: Shear test
Adhesive bondings in electronic applications - Bonding strength on surfaces - Part 1: Tensile test
Draft Document - Adhesive bondings in electronic applications - Determination of thermal conductivity of materials for heat dissipation
Bitumens and bituminous binders - Specification framework for cationic bituminous binder emulsions
