Binding strength measurement

Binding strength measurement, Total:5 items.

In the international standard classification, Binding strength measurement involves: Vacuum technology, Semiconductor devices, Electromechanical components for electronic and telecommunications equipment, Footwear, Adhesives, Paper and board.

General Administration of Quality Supervision, Inspection and Quarantine of the People‘s Republic of China, Binding strength measurement

• GB/T 28786-2012 Vacuum technology.Methods of bouding strength measurement for vacuum coating film.Measuring adhesion by tape test

British Standards Institution (BSI), Binding strength measurement

• BS EN 62047-9:2011 Semiconductor devices. Micro-electromechanical devices. Wafer to wafer bonding strength measurement for MEMS
• BS EN 62047-9:2013 Semiconductor devices. Micro-electromechanical devices. Wafer to wafer bonding strength measurement for MEMS
• BS 5131-1.9:1985 Methods of test for footwear and footwear materials - Adhesives - Measurement of green strength of adhesive joints

Korean Agency for Technology and Standards (KATS), Binding strength measurement

• KS T 1329-2012 Testing method for inter bond strength of paper and paperboard as measured by z-directional tensile test

Others:   Shear strength measurement, Tensile Strength Flexural Strength Measurement, Shear strength measurement, Binding strength measurement, How to measure bond strength, Bond strength, How to measure binding strength, Bond Strength Test Method, Internal bond strength test method, Bond Strength Test, Binding force measurement, Material bonding strength, table binding strength, Bond strength, Bond Strength Test Tensile Method, table binding strength, Bound water measurement, Method for testing bond strength, Binding strength assay, Binding Strength Level 1.